One way is to use a standard convention such as the Association Connecting Electronics
Industries, or IPC Standards. The IPC is a global trade association for the electronic
interconnect industry (www.ipc.org) covering design, Printed Circuit Board manufacturing
and electronics assembly. Specific topics covered include: Acceptance, Fabrication,
Flexible Circuits, General, High Density / Fine Pitch, High Speed / Frequency, Materials,
Quality / Test. Some of the main IPC Standards addressing rigid Printed Circuit
Boards are highlighted in bold text below:
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Topic
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Description
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Acceptance
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IPC-1-600 is one of the most widely used documents, along with the IPC-A-610 (Acceptability
of Electronic Assemblies) and J-STD-001 (Requirements for Soldered Electrical &
Electronic Assemblies).
IPC-6010 covers qualification and performance of printed circuit boards (rigid and
flexible) as well as multichip modules and high density boards.
IPC-TR-40 Thermal characteristics of Multilayer boards.
IPC-TR-551 Quality assessment of PCBs used for mounting and interconnecting.
IPC-ML-960 Qualification and performance specifications for mass lamination panels.
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Fabrication
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Specifications for drilling, NC data, board dimensions & tolerances, and molded
interconnection.
IPC-2615 covers Printed Board Dimensions and Tolerances.
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Flexible Circuits
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Specification and qualification information is contained in IPC-6013A. Guidelines
& materials used for flexible boards in IPC-4202 to 4204.
IPC-M-102 contains 13 separate standards on performance, qualification, design,
assembly, etc.
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General
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Addresses packaging, documentation requirements, clean room assessments, and trouble-shooting.
IPC-PE-7404 Troubleshooting guide for printed board manufacturer and assembly.
IPC-T-50G Terms and definitions for interconnecting and packaging electronic circuits.
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High Density Interconnect
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Specification requirements for HDI (High Density Interconnect) and micro-via materials.
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High Speed/High Freq
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Guidelines and specifications for design and fabrication of high speed circuitry
including impedance controlled circuits, high speed logic design, microwave boards,
etc.
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Materials-Foils
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Defines the general requirements, qualification, inspection, and testing of metals
used in production of printed circuit boards.
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Materials – Laminate
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Same as above, except for laminates and non-metallic raw materials.
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Quality / Test
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Detailed descriptions of test and inspection procedures.
IPC-TM-650 is the complete guide for test methods for printed circuit boards and
connectors.
IPC-PC-90 Statistical process control.
IPC-QS-95 ISO9000 quality system.
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See www.ipc.org for more complete information or to purchase various standards.
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