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Build Specification
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| IPC Class (I, II, or III) |
Class II, III |
| UL Registration (UL 94V0 or others) |
UL796 & Ul 94VO |
| Layer Count |
| # of layers (min/max) |
1-10 Layers |
| Board Sizes |
| Maximum dimensions (in.) |
16" x 20" |
| Board Thickness |
| Board thickness range (in.) |
0.016 -0.125" |
| Thickness tolerance (%) |
7-10% |
| Core thickness range (in.) |
0.006- 0.031" |
| Warp & Twist |
| Maximum board warp (%) |
<1.0% |
| PCB edge to conductor |
| PCB Edge to conductor (in.) |
0.008" |
| Laminate Materials |
| External (FR4, FR406, RCC, etc.) |
FR4, FR406 |
| Internal (FR4, FR406, RCC, etc.) |
FR4, FR406 |
| Material Properties |
| Dk (Dielectric Constant #) |
4.2 -4.6 |
| Tg (Glass Transition in deg. C) |
130-170 |
| Surface Finish Capabilities |
| HASL (Y/N) |
YES |
| ENIG (Y/N) |
YES |
| Immersion silver (Y/N) |
YES |
| Other finishes (Types) |
Immersion Tin |
| Finish Thickness |
| HASL (in.) |
0.003-0.010" |
| ENIG (in.) |
2-3 micro inches |
| Immersion silver (in.) |
6-18 micro inches |
| Other finishes (Type: in.) |
Tin 32-48 micro inches |
| Lines/Spaces |
| External minimum (in./in.) |
0.006" |
| Internal minimum (in./in.) |
0.006" |
| Copper Thickness |
| External range (oz) |
0.5 - 2 Oz |
| Internal range (oz) |
1 -2 Oz |
| Internal Power range (oz) |
1- 2 Oz |
| Hole Plating |
| Minimum plating (in.) |
1 mil |
| Non-plated hole size tolerance (in.) |
+/-0.003" |
| Plated hole size tolerance (in.) |
+/-0.003 |
| Plating Aspect Ratio |
| Standard (Ratio #)Standard (Ratio #) |
1:04 |
| Extended (Ratio #) |
1:06 |
| Soldermask |
| Soldermask Type (LPI, Dry film, etc.) |
LPI |
| Minimum dam (in.) |
5 mil |
| Soldermask Registration |
| Standard Tolerance (in.) |
+/-0.004" |
| Extended Tolerance (in.) |
'+/-0.003" |
| Soldemask Image |
| Image Process (Photo, Laser, etc.) |
Photo |
| Silkscreen |
| Text Height (in.) |
0.035" |
| Stroke Width (in.) |
0.006" |
| Colors |
White, Black |
| Location accuracy (in.) |
+/-0.010" |
| VIAs (Smallest finished dia.) |
| Drilled (in.) |
0.010" |
| Buried (in.) |
0.012" |
| Via plugging |
| Percent plugged (%) |
A/R |
| VIA Pad Size |
| External (in.) |
0.020" |
| Internal (in.) |
0.024" |
| Routing |
| Tolerance (in.) |
+/-0.005" |
| V-score |
| Tolerance (in.) |
+/- 0.004" |
| PCB Test |
| Net List Test (% coverage) |
100% |
| IPC-9252, Class III (Y/N) |
YES |
| IPC-9252, Class III (Y/N) |
YES |
| Other Tests (Type/% coverage) |
|
| Impedance test (ohms/tolerance%) |
10 |
| Test Point Spacing |
| Spacing (in.) |
40 mil |
| Delivery Lead-time |
| Pre-production (days) |
5 - 10days |
| Production (days) |
10-15 days |
| On-time Delivery |
| OTD (% on-time) |
99% |