Capabilities:
- Single-sided / double-sided (rigid) PCBs
- Multi-layer (rigid) PCBs
- Buried vias
- Controlled impedance
- Materials include CEM1, FR4, FR404, FR5, Teflon, Getek, Microwave/High Frequency (Rogers), Polyimide, etc.
- Electroless nickel/immersion gold, immersion silver, immersion tin, HASL, SMOBC finishes.
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